The Proceedings of the National Academy of Sciences of the United States of America has reported a tremendous work by engineers from Utah University, U.S.A. The engineers are claiming that they have developed a material that is a key to speedy computing; the material that will lead computers work at a fantastic speed without getting over heated.
The technology that is put forward is a silicon semiconductor with a layer of metal deposited atop of it , the makers have entitled it as a “topological insulator”, the material behaves as a conductor and insulator simultaneously. The surface acts as a conductor to electricity while the interior working as an insulator. Discovered a decade back, the topological insulators provide quintessential speed to the computers.
But the major hurdle in developing the material is to create one with big energy gap. Energy gap is described as the amount of energy needed for electrons to conduct electricity in any material. With larger energy gaps, electrons tend to flow over the surface rather than its interior as a result a computer can function at super fast speed without getting over heated at room temperature.
Professor Feng liu with his fellows are able to deposit a layer of bismuth a top a silicon semiconductor, this yields a topological insulator with big energy gap. The professor also shared that this combination provides the largest energy gap ever foreseen and therefore this technology can easily enhance the working speed of appliances used on room temperature. The finding will provide a possibility of using quantum computers and fast spintronic devices on room temperature.
Quantum computers, the upcoming application of quantum mechanics, are predicted to provide billions of energy to computers as compared to conventional operating systems used today. Spintronic devices-the gadgets using spin of electrons for data storage and transmission in electronic items are yet another anticipated technology in terms of super-fast computing.
The research by Liu and his colleagues was sponsored by the National Science Foundation and the U.S. Department of Energy.